Arctis Cryo Plasma-FIB
Automated cryo-plasma-FIB for throughput and connectivity for the cryo-electron tomography workflow
Features
Correlation to light microscopy and relation in TEM
“On-board” integrated fluorescence microscope (iFLM) allows the same area to be observed with light, ion, or electron beams. Specially designed TomoGrids always ensure correct lamella alignment to the tomographic tilt axis, from initial milling through high-resolution TEM imaging.
High-quality lamellae with consistent thickness
Plasma source provides multiple ion species (xenon, oxygen, argon) for high-quality lamella preparation without gallium implantation. An ultra-clean working environment is ensured for multiple days through the proven combination of a compact sample chamber and a dedicated cryo-box for shielding against water condensation.
Automation and connectivity for cryo-tomography
The Autoloader enables robotic sample handling for up to 12 grids, provides direct connectivity to the cryo-TEM and minimizes sample contamination risks. Set up milling runs from anywhere via a web-based user interface and perform autonomous, multi-day jobs for automated lamella preparation. Plasma source enables high milling rates for fast, large-volume material removal.
Integrated fluorescence microscope (iFLM)
The Arctis Cryo-PFIB includes an integrated wide-field fluorescence light microscope (Thermo Scientific iFLM Correlative System), which enables fluorescence imaging at the electron/ion beam coincidence point. Fluorescence imaging for targeting, intermediate verification, and final target confirmation can easily be done before, in-between, and after the ion milling without moving the stage. The iFLM is set up for epifluorescent imaging and can be used in reflection and fluorescence mode; the 180° alpha tilt capability of the CompuStage allows imaging of the top and bottom surfaces of the sample, which can be helpful for thick samples.
Specifications
• High-performance PFIB column, with inductively coupled plasma (ICP) source for fast ion switching
• Voltage: 500 V to 30 kV
• Beam current: 1.5 pA – 2.5 μA
• Xenon, argon, oxygen
• Resolution (Xe+ beam): <20 nm at 30 kV
• High-stability Schottky field emission gun
• Minimum source lifetime: 12 months
• Auto bakeout, auto start and no mechanical alignments
• Continuous beam current control and optimized aperture angle
• In-lens detection system: T1 (BSE) and T2 (SE) / In-chamber: ETD (SE)
• Beam current range: 1.5 pA to 400 nA
• Accelerating voltage range: 200 V – 30 kV
• Resolution (with cryo-stage): ;2.6 nm at 2 kV
• Triple beam coincidence at sample position for photons, electrons, and ions
• 100x Zeiss Epiplan Neofluar NA 0.75; Piezo-driven objective
• 4.0 mm objective working distance
• Fluorescence and reflection (motorized filter changer)
• 4-channel fluorescence Semrock LED-DA/FI/TR/Cy5-B-000 (Quadband) BrightLine® fullmultiband filter set, optimized for DAPI, FITC, TRITC, & Cy5 and other like fluorophores, illuminated with LED-based light engines filters
• Basler a2A4504-18umPRO with Sony IMX541 CMOS sensor (20.2 MP resolution) camera
• >150 µm (diagonal) imaging FOV
• Completely oil-free pumping system
• <5 × 10-5 Pa Vacuum chamber pressure
(at cryo-conditions)
• Nitrogen-cooled Autoloader and CompuStage with Thermo Scientific DualBeam™ System cryo-box