Helios 5 EXL DualBeam
FIB-SEM TEM sample preparation for the semiconductor industry, enabling full-wafer analysis
The growing demand for high-performance, energy-efficient electronics is driving the development of advanced devices featuring smaller, more densely packed elements and intricate 3D structures. Ramping up production of these cutting-edge microprocessors, memory devices, and similar products is exceptionally challenging and requires high-resolution, atomic-scale analysis of deeply buried features. Transmission electron microscopy (TEM) has emerged as the preferred technique for such analysis, depending on high-quality samples produced through focused ion beam (FIB) milling.
The Thermo Scientific Helios 5 EXL DualBeam is a 300mm full-wafer FIB-SEM system specifically engineered to address the TEM sample preparation challenges in the semiconductor industry. It is capable of producing samples for the latest technology nodes, including sub-5nm processes and gate-all-around structures.
Maximizing Sample Throughput and Productivity
The Helios 5 EXL DualBeam leverages advanced machine learning and closed-loop end-pointing to deliver precise cut placement, ensuring consistent extraction of high-quality lamellae even from the most demanding samples.
With flexible automation capabilities, it streamlines the creation of ultra-thin TEM samples, providing unmatched sub-nanometer insights into a greater number of interfaces, films, and profiles. The system integrates wafer and defect navigation with recipe definition and execution in a single, fully automated workflow, optimizing sample throughput and increasing the efficiency of technical resources through a higher tool-to-operator ratio.
TEM image of a gate cross-section along a nanowire.
Features
Automated TEM Sample Preparation Software
The Thermo Scientific AutoTEM 5 Software integrates wafer and defect navigation with recipe definition and execution in a unified platform, ensuring operational efficiency and consistency across users of varying skill levels. AutoTEM Software simplifies TEM sample preparation, allowing users to easily schedule multi-site jobs for inverted, plan-view, and top-down TEM sample preparation workflows.
Repeatable Automated Deposition and Etching
Specifically developed to support automated TEM sample preparation, the Thermo Scientific MultiChem Gas Delivery System offers highly consistent deposition and etching capabilities. It features a motorized injection needle with saved position presets, enabling precise and reproducible gas delivery to the sample surface. Additionally, the MultiChem Gas Delivery System is engineered for easy serviceability, helping to maximize tool uptime.
Precision FIB Milling for Advanced Sample Preparation
The Helios 5 EXL DualBeam is equipped with the Thermo Scientific Phoenix Ion Column, delivering groundbreaking low-kV performance for superior TEM sample preparation.
Automated Alignments, High Resolution, and Consistent Results
The system’s high-performance Thermo Scientific Elstar Electron Column, featuring unique UC monochromatic technology, enhances resolution and TEM sample end-pointing. New SEM auto-alignment capabilities ensure consistent results across multiple tools and operators.
Automated Sample Manipulation and Lift-Out
The Thermo Scientific EasyLift Nanomanipulator provides an intuitive approach for lifting out and transferring TEM samples to a grid. With low-drift and high-precision movements, the EasyLift Nanomanipulator simplifies the creation of traditional or ultra-thin TEM lamellae. Its fast and accurate motorized rotation capabilities make it ideal for high-speed inverted or plan-view sample preparation.
Fab-Compatible Automated FOUP Loader (AFL) Option
The optional Automated FOUP Loader (AFL) enables the Helios 5 EXL DualBeam to be situated within the semiconductor wafer fab. Being located closer to the wafer process line (near-line) provides critical information up to three times faster than lab-based analysis of cleaved wafer pieces, accelerating the development of new processes and reducing the time needed to ramp up to high-volume production.
Specifications
• Gallium focused ion beam
• Up to 65 nA maximum beam current
• Low-voltage (500 V) performance for high sample preparation quality
• Ion beam resolution at coincident point and 30 kV: 4.0 nm using preferred statistical method
• Ion source lifetime: 1,000 hours guaranteed
• An ultra-high-resolution immersion-lens field-emission SEM (FESEM) column
• The ultra-stable Schottky field emitter gun features UC+ monochromator technology
• Electron beam resolution:
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- 1.0 nm @ 15 kV
- 0.9 nm @ 1 kV
• Electron source lifetime: 12 months
• Thermo Scientific MultiChem Gas Delivery System
• Slots for up to 6 individual chemistries
• Single gas injection system
• Port for up to 3 independent GIS units
• Elstar in-lens SE detector (TLD-SE)
• Elstar in-lens BSE detector (TLD-BSE)
• High-performance ion conversion and electron (ICE) detector for secondary ions (SI) and electrons (SE)
• Optical microscope with 920 µm field of view
• 30 kV STEM detector with BF/DF/HAADF segments
• Oxford EDS
• CAD Navigation Compatibility (NEXS and Synopsys Camelot)
• Thermo Scientific iFast Software Semiconductor Wafer Navigation (optional)
• Integrated defect navigation based on KLARF 1.2 and 1.8 standards
• User-defined wafer maps and site plans