Helios 5 Hydra DualBeam

PFIB SEM with multiple ion species for 3D EM and TEM sample preparation.

The Thermo Scientific Helios 5 Hydra DualBeam (plasma focused ion beam scanning electron microscope, PFIB-SEM) is a highly versatile, multi-application tool equipped with four different ion species—argon, nitrogen, oxygen, and xenon. This flexibility allows you to select the ideal ion for optimizing results on various sample types, including metals, batteries, fiber composites, and biological tissues. Whether preparing samples for scanning transmission electron microscopy (STEM), transmission electron microscopy (TEM), 3D materials characterization, volume electron microscopy, or cellular cryo-tomography, exceptional results begin with precise sample preparation.

The system allows users to switch seamlessly between argon, nitrogen, oxygen, and xenon ions in under ten minutes, without compromising performance. This groundbreaking flexibility significantly expands the scope of PFIB applications and enables research into ion-sample interactions to enhance existing techniques.

The Helios 5 Hydra DualBeam pairs the innovative multi-ion-species PFIB column with the monochromated Thermo Scientific Elstar UC+ SEM column, delivering advanced ion- and electron-beam performance. With intuitive software and unparalleled automation, the system offers enhanced ease of use and enables detailed observation and analysis of relevant subsurface volumes.

 

Multiple Plasma Ion Options
Allows laboratories to easily switch between four ion species (Xe, Ar, O, and N), enabling tailored optimization for various sample types, including silicon, metals, and biological cells.

Gallium-Free TEM
Enables the fast and efficient preparation of high-quality samples, including Ga+ free TEM, atom probe tomography, and resin-embedded specimens.

3D Tomography
Performs large-volume, high-resolution 3D tomography, integrating multi-modal subsurface 3D data from SEM, EDS, and EBSD techniques.

Cryogenic Imaging
Achieves high-contrast, high-resolution SEM imaging under cryogenic conditions, ideal for biological sample analysis.

Precision Milling Control
Delivers precise control over milling processes with workflow-based solutions and time-saving automated software for enhanced experiment efficiency.

Features

Multiple ion options for optimized PFIB results

The Helios 5 Hydra DualBeam is an all-in-one instrument with a unique multiple ion species PFIB column with four ion species (Xe, Ar, O, N) to be used as a primary beam with a patented, automated, fast, and easy switching capability (<10 minutes). The Helios 5 Hydra PFIB is Ga-ion free, which is vital for sensitive samples such as aluminum-containing materials. The multiple ion options do not require complex accessories to improve cut face quality (e.g., milling curtain mitigation).

Fast milling for large volume multi-modal 3D tomography

Subsurface or three-dimensional characterization is often required to better understand material properties. In many cases, large volumes inaccessible by conventional Ga+ FIB instruments are necessary to obtain representative and relevant results. The excellent high-current performance of the Helios 5 Hydra PFIB with optional Thermo Scientific Auto Slice & View Software empowers the fully automated acquisition of large volume 3D datasets in a multitude of modalities. This includes backscattered electron (BSE) imaging for maximum materials contrast, energy dispersive spectroscopy (EDS) for compositional information, and electron backscatter diffraction (EBSD) for crystallographic information.

3D imaging at cryogenic temperatures

The Helios 5 Hydra DualBeam can be equipped with an optional cryo-stage that can be used for dedicated cryo-lamellae preparation with AutoTEM Cryo or cryo-volume imaging with Auto Slice & View Software. With the Elstar SEM Column, excellent contrast is achievable to uncover sub-cellular details on high pressure frozen and plunge frozen samples. No staining is required.

Lamellae preparation with AutoTEM Software

High-quality sample preparation is critical for successful high-resolution material analysis with STEM or TEM. It is also considered to be one of the most challenging and time-consuming tasks in materials characterization labs. Conventional methods used to prepare ultra-thin samples required for S/TEM are slow and can require many hours, or even days, of effort by highly trained personnel. This is further complicated by the variety of materials and the need for site-specific information. Plasma FIB, coupled with optional AutoTEM Software, resolves many of these challenges.

Serial section electron microscopy with Auto Slice & View Software

Combined with optional Auto Slice & View Software, the Helios Hydra DualBeam offers high throughput and fully automated 3D data collection, even at cryogenic temperatures. This automates collection of contextual volume imaging.

PFIB spin mill for large planar milling and imaging

The optional Spin Mill method on the Helios 5 Hydra DualBeam provides large-area planar milling up to 1 mm in diameter and the ability to image large areas in a horizontal plane for surface polishing or 3D characterization. The Spin Mill process is fully automated and easy to set up using Auto Slice & View Software. Multiple areas for image acquisition within one Spin Mill experiment can be selected. Each area of interest can be imaged at different imaging settings based on the specificity of the experiment.  Learn more about Spin Mill Bio Method for planar imaging of resin-embedded CHO cells.

Fluorescence light microscope correlative system (iFLM)

The optional iFLM Correlative System is an integrated light microscope for cryo-correlative imaging inside the Helios 5 Hydra PFIB high-vacuum chamber allowing you to combine fluorescence imaging and ion milling within a single cryo-DualBeam microscope. Read the iFLM Correlative System datasheet.

Specifications

Ion optics

• High-performance PFIB column with unique Inductively Coupled Plasma (ICP) source supporting four ion species with fast switching capability
• Ion species (primary ion beam): Xe, Ar, O, N
• Switching time <10 minutes, only software operation
• Ion beam current range: 1.5 pA to 2.5 µA
• Accelerating voltage range: 500 V – 30 kV
• Maximum horizontal field width: 0.9 mm at beam coincidence point

Electron optics

• Extreme high-resolution field emission Elstar SEM Column with:
– Magnetic immersion objective lens
– High-stability Schottky field emission gun to provide stable high-resolution                      analytical currents
– UC+ monochromator technology
•  SmartAlign: user-alignment-free technology
•  60-degree dual objective lens with pole piece protection allows tilting larger    samples
• Automated heated apertures to ensure cleanliness and touch-free aperture exchange
• Electrostatic scanning for higher deflection linearity and speed
• Thermo Scientific ConstantPower™ Lens Technology for higher thermal stability
• Integrated Fast Beam Blanker

• Beam deceleration with stage bias from 0 V to -4 kV*
• Minimum source lifetime: 12 months

 

 

Electron beam resolution

• 0.7 nm at 1 kV

• 1 nm at 500 V (ICD)

 

Detectors

• Elstar in-lens SE/BSE detector (TLD-SE, TLD-BSE)

• Elstar in-column SE/BSE detector (ICD)

• Everhart-Thornley SE detector (ETD)

• IR camera for viewing sample/column

• High-performance in-chamber electron and ion detector (ICE) for secondary ions (SI) and electrons (SE)

• Thermo Scientific In-chamber Nav-Cam Camera for sample navigation

• Retractable, low-voltage, high-contrast, directional, solid-state backscatter electron detector (DBS)

• Integrated beam current measurement

Stage

• Stage: Flexible 5-axis motorized stage

• XY range: 110 nm

• Z range: 65 nm

• Rotation: 360° (endless)

• Tilt range: -38° to +90°

Supporting software

• “Beam per view” graphical user interface concept, with up to 4 simultaneously active quads
• Thermo Scientific SPI™ (simultaneous FIB patterning and SEM imaging), iSPI™ (intermittent SEM imaging and FIB patterning), iRTM™ (integrated real-time monitor) and FIB Immersion Modes for advanced, real-time SEM and FIB process monitoring and endpointing
• Patterns supported: lines, rectangles, polygons, circles, donuts, cross-sections and cleaning cross-sections
• Directly imported BMP file or stream file for 3D milling and deposition
• Material file support for “minimum loop time,” beam tuning and independent overlaps
• Image registration enables sample navigation in an imported image
• Sample navigation on an optical image

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