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Helios 5 PFIB DualBeam

Plasma focused ion beam scanning electron microscope for TEM sample preparation including 3D characterization, cross-sectioning and micromachining

The Thermo Scientific Helios 5 Plasma FIB (PFIB) DualBeam (focused ion beam scanning electron microscope, or FIB-SEM) delivers unmatched capabilities for materials science and semiconductor applications. For materials science researchers, the Helios 5 PFIB DualBeam provides large-volume 3D characterization, gallium-free sample preparation, and precise micromachining. For manufacturers of semiconductor devices, advanced packaging technology, and display devices, the Helios 5 PFIB DualBeam delivers damage-free, large-area de-processing, fast sample preparation, and high-fidelity failure analysis.

Features

Gallium-free STEM and TEM sample preparation
High-quality, gallium-free TEM and APT sample preparation thanks to the new PFIB column enabling 500 V Xe+ final polishing and delivering superior performance at all operating conditions.

Advanced automation
Fastest and easiest, automated, multisite in situ and ex situ TEM sample preparation and cross-sectioning using optional AutoTEM 5 Software.

Next-generation 2.5 μA xenon plasma FIB column
High throughput and quality statistically relevant 3D characterization, cross-sectioning and micromachining using next generation 2.5 μA Xenon Plasma FIB column (PFIB).

Multi-modal subsurface and 3D information
Access high-quality, multi-modal subsurface and 3D information with precise targeting of the region of interest using optional Auto Slice & View 4 (AS&V4) Software.

Sub-nanometer performance at low energies
Reveal the finest details using best-in-class Elstar Electron Column with high-current UC+ monochromator technology, enabling sub-nanometer performance at low energies.

Complete sample information
The most complete sample information with sharp, refined, and charge-free contrast obtained from up to six integrated in-column and below-the-lens detectors.

Advanced capabilities
Most advanced capabilities for electron and ion beam induced deposition and etching on FIB/SEM systems with optional Thermo Scientific MultiChem or GIS Gas Delivery Systems.

Artifact-free imaging
Artifact-free imaging based on integrated sample cleanliness management and dedicated imaging modes such as SmartScan™ and DCFI Modes.

Short time to nanoscale information
Shortest time to nanoscale information for users with any experience level with SmartAlign and FLASH technologies.

Precise sample navigation
Precise sample navigation tailored to individual application needs thanks to the high stability and accuracy of 150 mm Piezo stage and optional in-chamber Nav-Cam.

Specifications

Ion optics

• High performance PFIB column with Inductively Coupled Xe+ Plasma (ICP)

Ion beam current range: 1.5 pA to 2.5 µA

Accelerating voltage range: 500 V – 30 kV

Maximum horizontal field width: 0.9mm at beam coincidence point

•  Ion beam resolution at coincident point

<20 nm at 30 kV using preferred statistical method

<10 nm at 30 kV using selective edge method

Electron optics

• Elstar extreme high-resolution field emission SEM column with:

  • Immersion magnetic objective lens
  • High-stability Schottky field emission gun to provide stable high-resolution analytical currents
  • UC+ monochromator technology

 

Electron beam resolution

• At optimum WD

•  0.6 nm at 15 kV

• 1 nm at 500 V

• At coincident point

• 0.7 nm at 15 kV

• 1.2 nm at 1 kV

 

Detectors

• Elstar in-lens SE/BSE detector (TLD-SE, TLD-BSE)

• Elstar in-column SE/BSE detector (ICD)*

• Everhart-Thornley SE detector (ETD)

• IR camera for viewing sample/column

• High-performance ion conversion and electron (ICE) detector for secondary ions (SI) and electrons (SE)

• In-chamber Nav-Cam sample navigation camera*

• Retractable low voltage, high contrast directional solid-state backscatter electron detector (DBS)*

• Integrated beam current measurement

Stage and sample

High-precision, 5-axis motorized stage with XYR axis, piezo-driven

  • XY range: 150 mm
  • Z range: 10 mm
  • Rotation: 360° (endless)
  • Tilt range: -38° to +60°
  • XY repeatability: 1 μm
  • Max sample height: Clearance 55 mm to eucentric point
  • Max sample weight at 0° tilt: 500 g (including sample holder)
  • Max sample size: 150 mm with full rotation (larger samples possible with limited rotation)
  • Compucentric rotation and tilt
Manufacturer

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