Key features include the advanced Smart Stage, Ultra-X EDS detector, high-brightness X-CFEG source, and Smart Automation software. Together, these innovations ensure enhanced efficiency, rapid elemental analysis, and recipe-free automation, making it ideal for scalable lab operations while maintaining data integrity.
Enhanced Productivity and Data Integrity
The newly redesigned Smart Stage and Ultra-X EDS detection system significantly boost sample throughput, delivering approximately a 15% improvement in TEM metrology performance and doubling the speed of EDS elemental analysis. The Smart Stage facilitates fully automated sample loading and precise navigation to regions of interest (ROI). Additionally, the constant power lenses allow for rapid high-tension switching in under 20 minutes, improving tool availability.
Data integrity is ensured through piezo-driven Smart Stage tilt movement and Thermo Scientific Smart Automation Software, offering exceptional (S)TEM imaging quality. This advanced hardware-software integration provides precise tilt accuracy and movement. Smart Automation includes features such as Smart Auto Zone Axis (AZA) alignment, smart tilt, and tool readiness. Smart AZA aligns high-order silicon zone axes (e.g., Si<130>) within the ROI, while smart tilt precisely aligns 3D NAND planar samples for accurate metrology. Tool readiness maintains essential tool alignment for consistent, high-quality data and reliable TEM automation.
Fast elemental analysis
The Metrios 6 (S)TEM with the Ultra-X EDS detector brings a new level of EDS detection to high-throughput solutions. The advanced Ultra-X EDS detector provides a 4.45 srad solid angle, delivering at least 2x greater data collection efficiency than the previous generation of detectors. This enables collection of data in less time while preserving the integrity of beam-sensitive samples. In addition to these capabilities, Ultra-X unlocks new EDS analysis opportunities with the cleanest EDS spectra, (<1% spurious peaks)
Recipe-free Automation for (S)TEM Metrology
This fully automated, recipe-free system leverages machine-learning algorithms to drastically cut down setup time for new processes or sample types, offering both ease of use and scalability. Tailored Smart Automation is designed for specific applications, supporting various semiconductor devices like gate-all-around (GAA), DRAM, and 3D NAND. The new web-based segmenter and object detection algorithms speed up model training by 50x on device structures. Furthermore, Smart Automation is adaptable, ensuring compatibility with future semiconductor R&D and manufacturing advancements.
• 60–200 kV
• Ultra-stable, high-brightness Schottky field emission gun (X-FEG)
OR
• Ultra-high-brightness cold field emission gun (X-CFEG) with an energy resolution of <0.4 eV
• Five-axis, piezo-driven Smart Stage with minimum XYZ step size of ≤20 pm
• New high-accuracy double-tilt holder designed for Smart Stage
• Smart Automation software allows setup of new automation routines in <4 hours for selected workflows
• EDS quantification using Thermo Scientific Velox Software, featuring dynamic correction of holder shadowing as a function of tilt
Webinars
Semiconductor metrology and process characterization has a new performance standard
Automated STEM-EDS Metrology and Characterization of DRAM Capacitors
Blog
Automated Metrology Becomes a Reality with New Scanning Transmission Electron Microscope
Application note
Innovative TEM metrology solution on blanket films